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Surface Defect Mitigation of Additively Manufactured Parts Using Surfactant-Mediated Electroless Nickel Coatings.
Jolly et al., Materials (Basel) 2024
DOI: 10.3390/ma17020406
Novel Use of Electroless Ni-B Deposition for AM Defects
New Information: This study introduces a novel application of electroless nickel-boron (Ni-B) deposition, a technique inspired by the electronics industry, to address defects in ferrous-alloy additively manufactured (AM) parts.
Importance: The research is significant as it proposes a solution to improve the mechanical performance of AM parts by reducing surface roughness and porosities, which are common issues in early production phases.
Contribution to Literature: The study contributes to the current literature by exploring the use of surfactants in the electroless Ni-B deposition process to enhance defect filling. Two surfactants, CTAB and PEG, were tested at various concentrations to optimize the levelling effect.
Results: The findings indicate that the surfactant type and concentration critically influence the defect filling efficacy. The best results were achieved with a high molecular weight PEG at a concentration of 1.2 g/L, leading to the highest levelling percentages.
Conclusion: The research suggests that electroless Ni-B deposition, particularly with the use of PEG surfactant, could be an effective method for repairing defects in ferrous-based AM parts, potentially enhancing their application in various industries.